The research team ran nineteen drills in three days. Some began with a mild warning over the intercom: “Ladies and gentlemen, this is your captain speaking. We will be encountering a line of thunderstorms in about ten minutes.” The rest began more urgently: “All passengers and flight attendants, please be seated immediately.” The more emphatic announcement prompted a quicker reaction. Still, at best, only two-thirds of the occupants were buckled up after seventy seconds. On average, the passengers needed a minute and a half to take their seats; the flight attendants, who had to stow their gear first, needed at least four minutes. Fully a third of the occupants were still out of their seats after seventy seconds.
变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
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